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Lets Do Ball Grid Array Re Balling at home, ill show you my methods and some neat tips and tricks you can utilise.
Che cosa è il Reballing: Il reballing è un processo delicato che consiste nel rimuovere il BGA , tramite macchine professionali ibride , riscaldando a infrarossi , e successivamente prevede la sostituzione del vecchio stagno ossidato e crepato con dello stagno nuovo di una lega differente e di miglior qualità.
This video goes into a little more detail with regards to BGA reballing and shows how to correctly apply flux and solder balls for a successful reball procedure every time.
BGA reballing and soldering Xilinx IC. How to reball without BGA stencil.
Please Note - Retronix provides reballing as a service. We do not sell the machine. Retronix takes BGA Laser Reballing to the next level in accuracy and consistency with the installation of the top of the line system! Retronix are the only company to offer Laser Reballing, mitigating the need for an additional reflow thus protecting the device. With the introduction of the latest laser technology this gives Retronix the ability to laser high melt solder balls (HMP), as well as plastic and copper cored solder balls. Retronix are the only company with approvals from such customers as Leonardo, BAE, Meggit Avionics and Martin Baker Air Craft Company and many more high reliability companies are realising the need to minimise the amount of reflows you give any single component therefore using a laser to perform the reballing is the only way to guarantee that there is no long term damage to the silicon. Retronix are AS9100D certified. Please Note - Retronix provides reballing as a service. We do not sell the machine. Know More - 🤍 Contact Us - 🤍 Email - marketing🤍retronix.com | Tel : +44 (0)1236433345 Our Locations - 🤍 Our Certifications - 🤍 Connect with us - Twitter - 🤍 LinkedIn - 🤍 Facebook - 🤍
How to use 90*90mm BGA Reballing Kit Stencils Holder for Laptop P3 PS4 BGA Chip Reballing More Details and Price, Welcome to contact us. Whatsapp : +86 150 1921 1735 Skype: Leronli515 Wechat: Leronzhuomao
What is BGA (Ball Grid Array) and Why BGA is Needed? BGA or Ball Grid Array is one type of packaging for Surface Mount Technology (where SMD electronic components are actually mounted or affixed on the surface of the SMT printed circuit board). A BGA package has no leads or pins. The Ball Grid Array gets its name because it is basically an array of metal alloy balls arranged in a grid. These BGA Balls are normally Tin/Lead (Sn/Pb 63/37) or Tin/Silver/Copper (Lead-Free). Advantages of BGA over SMD The PCB or Printed Circuit Board in today’s electronic devices and gadgets are densely populated with electronic components. The size of the Circuit Board will increase with increase in number of electronic components. In order to squeeze the size of the PCB, SMDs and BGA Packages are used because both SMD and BGA are smaller and slimmer in size and occupy very little space on the PCB. BGA components provide better solution for many Types of PCB, but care is required when soldering BGA components to ensure that the BGA solder process is correct and is reliable. BGA offers following advantages over SMD Components: Improved PCB design as a result of lower track density. The BGA package is robust. Lower thermal resistance. Improved high speed performance and connectivity. BGA Soldering Process During the initial stages, BGA technology was a matter of concern. People had doubts on solderability and reliability of BGA components. In BGA, the pads are under the device and not visible and hence it is necessary to ensure the correct process of soldering and inspection. Today, BGA soldering techniques is tried and tested and has been proved and trusted to be very reliable. It has also been learnt that once the process is set up correctly, BGA solder reliability is mush higher than that for quad flat packs (QFP) or any other SMD Package. BGA Rework / Repairing – Hand Soldering and Desoldering of BGA Rework and hand soldering of BGA Packages is the toughest part. It needs practice to do the job. Let us understand Desoldering and soldering of BGA packages by hand BGA Desoldering by Hand The most common practice to desolder BGA is hot air. Here are the steps to desolder BGA Package using Hot Air: Apply liquid flux on the sides of the package. Preheat the package from both top and bottom. Heat can be given from the bottom using a preheater while heat from the top can be given using a Hot Air Rework System. Goot Hot Air SMD / BGA Rework System can be used here. Now using the correct BGA Nozzle, give heat on top of the BGA Package. The solder balls underneath the BGA package will melt. Pick up the package with a Tweezers OR using vacuum pick-up tool. BGA Soldering by Hand Again the most common practice to solder BGA is hot air. Here are the steps to solder BGA Package using Hot Air: Once the BGA Package is removed, clean the pad and remove any excess solder from the board. 1.Apply Flux Paste (Not Liquid Flux) on to the pad. Paste flux will help solder balls to stick so that they do not fall or change position. 2.Place solder balls very carefully on the pad. 3.Apply paste flux to the bottom (soldering side) of the BGA package. 4.Carefully place the BGA Package on the solder balls. 5.Preheat and then apply Hot Air with Hot Air Blower from both top and bottom. 6.Solder balls will melt and get soldered.
Facebook: 🤍 Więcej na: 🤍 Wymiana układu BGA G86-735 GeForce 9300 w laptopie Asus F3S. Wymian układu na nowy, nie reballing BGA. Reballing BGA w przypadku wadliwych układów nVidia jest naprawą nieskuteczną i krótkotrwałą. Listę wadliwych układów nVidia możesz zobaczyć tutaj: 🤍 Więcej informacji na temat wadliwości układów i nieskutecznych napraw: 🤍
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This video is about BGA reballing process and how to use the BGA reballing kit. We produce BGA rework reballing station and BGA Reballing tools, like Reballing kit, rebaling stencils, solder ball, flux paste, etc, with factory price. More Details and Quotation, Please feel free to contact us. Leron Lee Whatsapp: +86 150 1921 1735 Skype: Leronli515 Wechat: Leronzhuomao Email: Leronelectronic🤍gmail.com
In this video, I am reballing without a stencil an 0.8mm pitch 100pins BGA chip. Tools that I use: Hot Air Station: 🤍 Microscope: 🤍 Microscope camera: 🤍 Camera adapter: 🤍 PCB holder: 🤍 RIDEN Power Supply Module: 🤍 Soldering Iron: 🤍 Soldering Tips: 🤍 Tweezers: 🤍 Solder: Loctite 60/40 0.5mm Solder wick: 🤍 Flux: 🤍 Thermal Camera: 🤍 Oscilloscope: 🤍 Electronic load: 🤍 Multimeter: 🤍 ET4410 LCR Meter: 🤍 My Patreon: 🤍 #Reballing #Soldering #Reflowing BGA Chip Reballing (without a stencil)
Basic eMMC BGA 153 Reballing Tutorial for Beginners | Tech Tomer GCASH Donation: +639668479676 PayPal Donation: 🤍 Disclaimer: Tools shown in this video are not sponsored Basic tools: * Tweezers * Soldering Iron * Soldering Iron Tip Refresher * Solder Wick * Paste Flux * BGA Solder Paste * PCB Cleaner * PCB Holder * 6 in 1 eMMC BGA Plate * Hot Air Gun * Microscope with Camera #TechTomer #eMMCBGA153 #ReballingTutorial Also, Watch my Other Videos: How to (Bypass) Lenovo Tab M8 TB-8505X | FRP Google Activation, Android 10 ( Tutorial ) - 🤍 How to Reball NAND IC ( Tutorial ) - 🤍 How to Reball eMCP BGA 254 ( Tutorial ) - 🤍 How to Reball eMMC BGA 162 ( Tutorial ) - 🤍 How to Reball eMMC BGA 221 ( Tutorial ) - 🤍 Facebook - 🤍 Instagram - 🤍
Kann man ein Ball Grid Array wiederverwenden? Ersa zeigt Ihnen die wichtigsten Schritte, um ein BGA-Bauteil wiederzuverwenden. Mehr zu unseren Produkten ► 🤍 Nach dem Auslöten wird das Restlot entfernt. Anschließend werden neue Lötkugeln aufgebracht und schließlich werden diese mit einem Rework-System umgeschmolzen. Fertig ist das Reballing! Mit freundlicher Unterstützung von ► Wagenbrett GmbH & Co. KG. Der gesamte Prozess wurde in 5 einzelne Videos aufgeteilt: #4.1 BGA-Entlöten: 🤍 #4.2 BGA-Landeflächen vorbereiten: 🤍 #4.3 BGA-Platzierung: 🤍 #4.4 BGA-Einlöten: 🤍 #4.5 BGA-Reballing: 🤍 Folgen Sie uns! ► Website: 🤍 ► Facebook: 🤍 ► Twitter: 🤍 ► LinkedIn: 🤍
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Bga Ic Reballing Perfect Technique | Universal Stencil Cpu Reballing Trick | How To Reball Mobile Cpu | Mobile Ka CPU Universal Stencil Se Kaise Reball Karne | How To Reballing Mobile Cpu For Universal Stencil Top 5 Video 👇👇👇 Without Microscope Chip Level Work :- 🤍 Motherboard Swapping :- 🤍 Network Section Tracing :- 🤍 Dead Mobile Fault Tracing :- 🤍 How To Check Smd Capacitor :- 🤍 Welcome To GSM Rakesh Channel Hi Frnds My Name is Rakesh Telegram :- 🤍 Website :- 🤍 Facebook :- 🤍 Instagram :- 🤍 Youtube :- 🤍 Email :- Sagarmobile3🤍gmail.com For Sponsorship & Business Enquiries :- Sagarmobile3🤍gmail.com Plz Like And Subscribe Thanks For Watching...
This video is showing you how to repair graphics cards AMD-ATI Radeon or Nvidia with BGA problem. Why Reballing ? The graphics chip is soldered to the board with hundreds small solder balls (BGA) and one or more solder joints crack with time due to the thermal cycle which creates thermal stress (contraction and expansion 🤍 and the graphics card stops working, old thermal paste or paste with bad heat conductivity and clogged cooler increase the thermal stress, with this procedure we replace the solder balls and resolder the chip to the board and the graphics card works again. I prefer reballing over reflow because reflow is not a long term solution and the black screen or artifacts will return again soon. Reballing is more reliable and is the preferred GPU repair method. Watch also my other videos about Reballing - Rework. Thanks for watching, don't forget to Like and Subscribe T12 Digital Soldering station: 🤍 Notebook RepairBlack Screen: 🤍 Reballing Sapphire Radeon HD 7870 XT: 🤍 DIY HomeMade BGA Rework Station: 🤍 DIY HAKKO T12 Digital Soldering Iron: 🤍
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Facebook: 🤍 Więcej na: 🤍 Przedstawiamy reballiing układu RSX w konsoli Playstation 3 (PS3). Do reballingu PS3 użyto stacji na podczerwień. Reballing w przypadku PS3 jest jedyną skuteczną metodą naprawy takich usterek jak YLOD czy też RLOD, nie zalecamy domowych napraw takich jak piekarnik czy opalarka. Więcej na temat domowych napraw pod adresem: 🤍
BGA REBALLING service is provided by Factronix 🤍 and RETRONIX 🤍. This BGA reballing methode applies heat to the BGA for only some milliseconds. So there is no thermal stress to the component but excellent co-planarity and strong adhesion "as new". This rework service is performed by Factronix: 🤍 and RETRONIX: 🤍
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LCD TV CPU IC BGA Reballing Stencil - Amaoe Magnetic BGA Tin Paste Planting Platform Tool We have the BGA Reballing Tools Stencils Reballing Holder kit, BGA Solder Ball, Flux Paste, BGA Preheater Oven,etc More Details, Welcome to contact us. Leron Email: Leronelectronic🤍gmail.com Whatsapp: +86 150 1921 1735 Skype: Leronli515 Wechat: Leronzhuomao
This is a video showing you how to repair Nvidia graphics cards. Why Reballing ? The graphics chip is soldered to the board with hundreds small solder balls (BGA) and one or more solder joints crack with time due to the thermal cycle which creates thermal stress (contraction and expansion) and the graphics card stops working, old thermal paste or paste with bad heat conductivity and clogged cooler increase the thermal stress, with this procedure we replace the solder balls and resolder the chip to the board and the graphics card works again, reballing is more reliable and is the preferred GPU repair method. If you are new to reballing i hope this video helps you. Thanks for watching, don't forget to Like and Subscribe Signs of graphics problems: 1: PC turns on but does not show anything on the screen ( black screen ) 2: PC turns on and displays weird graphical artifacts, white screen or divided screen. And usually graphics failure is caused by insufficient cooling, the cooling system is clogged with dust resulting in overheating and graphics failure. T12 Digital Soldering station: 🤍 Reballing Sapphire HD 7950 - R9 280X 🤍 DIY HomeMade BGA Rework Station: 🤍
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This product is R&D by our company, it is our patented product, good reballing effect, high maintenance rate, win the recognition of the majority of customers, welcome business cooperation and contact.
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Join Us For Discussions: 🤍 Dear Subscribers.!! How to eMMC-CPU-BGA Mobile ic Reballing - BGA Reballing Tips Any Happy new year 2020. In this video, I'll show you how can make easy Mobile ic Reballing, Reball eMMC, Reball CPU, Reball Power IC Or Any BGA Reballing use full tips. Useful Links: 🤍 Buy Latest BGA and Reballing equipment here 🤍 Premier online shopping destination: Wholesales Price For GSM Unlocking, Flashing Box and Dongle. Mobile Phone LCD, Spare Parts, HotAir Station, Remove iCloud IC Chip & Lot More #Mobile #IC #Reball #MartviewForum #UFixers
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